Belton Technology Group’s SMT Flip Chip assembly lines are set up in a cleanroom environment to ensure product quality with a high production yield. We are currently producing over 2.5 million assemblies per week.
Our SMT Flip Chip assembly lines are equipped with state-of-the-art machines and technology to handle fine pitch printing, 0201 chips and Flip chip / BGA with bump diameter as small as 0.05mm. Our products are lead free, produced by re-flow oven with closed-loop nitrogen control system. Our Jet Dispensing machine is capable of dispensing between line width of 0.25mm.
